| POWER-TECH KEYBOARD SWTICH CO., LTD. |
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Item Number:
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PRINTED CIRCUIT BOARDS |
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Description:
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SINGLE-SIDE, DOUBLE-SIDED, SILVER AND CARBON THRU-HOLE, RIGID-FLEX, MULTILAYER PRINTED CIRCUIT BOARDS.
PRODUCTION:FR-4, BT, POLYMIDE, TEFLON, 4-8 LAYERS.
DOUBLE-SIDED BOARD UP TO 0.1mm, 4-LAYERS UP TO 0.3mm, 6-LAYERS UP TO 0.5~0.6mm. |
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Specification:
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| PRODUCTION |
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SINGLE-SIDED, DOUBLE-SIDED, MULTI-LAYERS, SILVER AND CARBON
THRU-HOLE, RIGID-FLEX PCB. |
| MATERIAL |
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FR-4BT, POLYIMIDE, TEFLON, 4=8 LAYERS, MULTI-LAYERS. |
| CIRCUIT WIDTH & SPACE |
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4 milj (0.1mm) Mimimum |
| SMT PADS DISTANCE |
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16 milj (0.4mm) Central Minimum |
| HOLE SIZE |
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8 milj (0.2mm) Minimum |
| PRECISION HOLE |
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+/- 2 milj (0.05mm) Ture position and location |
| BLIND/BURIED HOLE |
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6 milj (0.15mm) Laser Drilling (Special requirement can be
request). |
| BOARD THICKNESS |
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DOUBLE-SIDED UP TO 0.1mm, 4 LAYERS UP TO 0.3mm, 6 LAYERS UP
TO 0.5 TO 0.6mm. |
| PLATING THICKNESS |
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COPPER UP TO 25 MICRON, HOT AIR SOLDER LEVELLING UP TO 4 MICRON,
NICKEL UP TO 7 MICRON. |
| REMARK |
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We provide Gold Plating or Electroless Gold for board surface
treatment up to over 0.2milj. |
MACHINEERY EQUIPMENT:
| CAD SYSTEMS |
INFRA-RED CONVEYEROVEN SYSTEMS |
| ART-WORKS AND FILM SYSTEMS |
UV CONVEYER OVEN SYSEMS |
| CNC DRILLING SYSTEMS |
BAKING OVEN SYSTEMS |
| PUNCH PRESS SYSTEMS |
ELECTRIC HEAT LAMINATOR |
| ELECTROLESS COPPER PLATING LINE |
SURFACE CLEAN TREATMENT SYSTEMS |
| COPPER AND SOLDER PLATING LINE |
PEEL STRENGTH TESTING SYSTEMS |
| NICKEL AND GOLD PLATING LINE |
MICROSCOPE SYSTEMS |
| SURFACE CLEANING BRUSH MACHINE |
VOLTAGE, INSULATION, RESISTANCE TESTING SYSTEMS. |
| ETCHING AND STRIPPING MACHINE |
HIGH TEMPERATURE HUMIDITY SYSTEMS |
| DRY FILM LAMINATOR |
EXPOSURE MACHINE |
| SILK SCREEN PRINTING MACHINE |
HIGH-TENSION TESTING SYSTEMS |
| AUTO SCRUBBING LINE |
CARBON IPQC SYSTEMS |
| DRY & WET FILMS PRINTING SYSTEMS |
VISUAL INSPECTION SYSTEMS |
| CIRCUIT IPQC SYSTEMS |
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