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Item Number:	200
Product Name:	High TG, heavy copper, blind and buried via PCB 16layers
Description:	Techological Capacity of Our products: Layer couts: 2-24 Materials:FR-4(S1130/S1141/S1170),HTG FR-4,Rogers,Berquist,thermagon etc. Maximum Size: 700*1100mm Copper foil thickness: 0.5-13oz Min Line Width/Space: 3mil/3mil Min Finished Hole: 0.15mm Aspect ratio: 12:1 Impedance Control: +/-10% Surface treatment: tin masking(lead free),Chemical Gold/Tin/Silver, OSP,Gold Finger
Features:	Manufacturing service capabilities of our capany: High density interconnect (HDl) Impedance control Blind and buried vias Up to 3mi/s Trace/space width Rigid, flex and rigid-flex boards Various standard laminates and exotics including FR4,Rogers,Berquist,thermagon,(taconic) etc. Full body hard gold
Safety Approval:	UL,ROHS

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