| Witgain Technology LTD. |
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Item Number:
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HDI PCB (Printed Circuit Board) |
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Product Name:
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HDI PCB (Printed Circuit Board) |
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Description:
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Layer(mass production): 2 to 24 layers.
Max Panel Size: 450*660mm.
Copper Clad Laminate: FR4, FR4(Halogen free), FR5, CEM-1, CEM-3, PTFE, Rogers, Getek, BT, Polyimide, Al Base,
High-TG.
Finished Board Thickness: Min:6mil(0.15mm), Max:280mil(7mm).
Min hole size: Mechanical drilling:8mil(0.2mm), Laser drilling:4mil(0.1mm).
Min line width/space: 3/3mil.
Surface Treatment: Hot Air Leveling, Gold/Nickel Plating, Immersion Gold/Tin/Sliver, Gold Finger, Peeable mask,
Carbon Ink, OSP(Entek,F2).
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Features:
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Layer(mass production): 2 to 24 layers.
Max Panel Size: 450*660mm.
Copper Clad Laminate: FR4, FR4(Halogen free), FR5, CEM-1, CEM-3, PTFE, Rogers, Getek, BT, Polyimide, Al Base,
High-TG.
Finished Board Thickness: Min:6mil(0.15mm), Max:280mil(7mm).
Min hole size: Mechanical drilling:8mil(0.2mm), Laser drilling:4mil(0.1mm).
Min line width/space: 3/3mil.
Surface Treatment: Hot Air Leveling, Gold/Nickel Plating, Immersion Gold/Tin/Sliver, Gold Finger, Peeable mask,
Carbon Ink, OSP(Entek,F2).
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Specification:
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Layer(mass production): 2 to 24 layers.
Max Panel Size: 450*660mm.
Copper Clad Laminate: FR4, FR4(Halogen free), FR5, CEM-1, CEM-3, PTFE, Rogers, Getek, BT, Polyimide, Al Base,
High-TG.
Finished Board Thickness: Min:6mil(0.15mm), Max:280mil(7mm).
Min hole size: Mechanical drilling:8mil(0.2mm), Laser drilling:4mil(0.1mm).
Min line width/space: 3/3mil.
Surface Treatment: Hot Air Leveling, Gold/Nickel Plating, Immersion Gold/Tin/Sliver, Gold Finger, Peeable mask,
Carbon Ink, OSP(Entek,F2).
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Safety
Approval:
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UL, ISO9002, QS9000, ISO14001, ISO9001 and TS16949. |
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